Author(s): Jasleen Kaur, Renu Vig, Harvinder Kaur
Published in: International Journal of Engineering Research & Technology
License: This work is licensed under a Creative Commons Attribution 4.0 International License.
Volume/Issue: Volume. 6 - Issue. 08 , August - 2017
Silicon (Si) based Micro Electro Mechanical Systems (MEMS) are now well understood and widely used in various integrated micro machined microsensors and microactuators, In addition to this, gallium arsenide (GaAs) offers a number of material-related properties and technological advantages over Si . These include well known properties, such as direct band gap transition and high electron mobility but GsAs also offers some disadvantages due to which is it not so suitable for thermal actuator. This can be shown with the help of FEM simulation.. Heat transfer through and around these microstructures are very complex.In this paper we present an analysis of this microstructures and perform its FeM analysis using comsolmultiphysics 4.2. We have a model which is used to compare the behaviour of thermal microactuator made up from polysilicon and Gallium Arsenide.We will study the various others parameters also. With the applied voltage and varying geometrical dimension gives a clear understanding of the performance of the structure.
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